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 Reflective Photosensors (Photo Reflectors)
CNB2003
Reflective photosensor
I Features
6.10.3 0.35
1 3 C0.5 Chip center
* Reflow-compatible reflective photosensor * Ultraminiature, thin type: 2.7 mm x 3.4 mm (height: 1.5 mm)
1.7
I Applications
* Object sensing, non-contact point SW
2 0.7
4 0.5
1.7
0.85 1.5
I Absolute Maximum Ratings Ta = 25C
Parameter Input (Light Reverse voltage (DC) Power dissipation *1 Output (Photo Collector current transistor) Collector to emitter voltage Emitter to collector voltage Collector power dissipation *2 Temperature Operating ambient temperature Storage temperature Symbol VR IF PD IC VCEO VECO PC Topr Tstg Rating 6 50 75 30 35 6 75 -25 to +85 -40 to +100 Unit V mA mW mA V V mW C C
1: Anode 2: Cathode 3: Emitter 4: Collector (Note) Tolerance unless otherwise specified is 0.2
Color of rank
emitting diode) Forward current (DC)
Note) *1: Input power derating ratio is 1.0 mW/C at Ta 25C. *2: Output power derating ratio is 1.0 mW/C at Ta 25C.
I Electrical Characteristics Ta = 25C 3C
Parameter Input Forward voltage (DC) Symbol VF IR ICEO IC ID tr tf Note) *1: Output current (IC) measurement method (see figure below)
Glass plate evaporated Al d = 1 mm
Conditions IF = 20 mA VR = 3 V VCE = 10 V VCC = 2 V, IF = 4 mA, RL = 100 , d = 1 mm VCC = 2 V, IF = 4 mA, RL = 100 IF = 4 mA, IC = 0.5 mA VCC = 2 V, IC = 10 mA RL = 100
Min
Typ 1.2
Max 1.4 10 1.0
0.7 max.
2.7
0.7 max.
3.4 1.8
Unit: mm
0.15
Unit V A A mA A V s
characteristics Reverse current (DC) Output Collector cutoff current characteristics Transfer Collector current *1
0.52
15.0 5.0 1.2 120 115
characteristics Leakage current
*2
Collector to emitter saturation voltage VCE(sat) Response time
*2: Response time measurement circuit (see figure below)
Glass plate evaporated Al d = 1 mm tr: Rise time tf: Fall time
Color indication of classifications Class Q R S
90% 10%
IC (mA) 0.52 to 1.94 1.45 to 5.40
Color Orange White
Sig. in
IF RL IC VCC Sig. in 50 RL Sig. out VCC
4.00 to 15.00 Light blue
Sig. out tr tf
Input and output are handled electrically This product is not designed to withstand radiation
Publication date: October 2001
SHG00057AED
1
CNB2003
IF , IC Ta
Forward current, collector current IF , IC (mA)
60 IF 80 Ta = 25C 50
IF V F
103
IC I F
VCC = 5 V Ta = 25C RL = 100 d = 1 mm
40 IC
Forward current IF (mA)
60
Collector current IC (mA)
0 0.4 0.8 1.2 1.6
102
30
40
10
20
20
1
10
0 -25
0 0 20 40 60 80 100
10-1 1 10
102
103
Ambient temperature Ta (C)
Forward voltage VF (V)
Forward current IF (mA)
VF Ta
1.6 1.4
IC VCE
102 Ta = 25C IF = 10 mA
IC T a
160 140 VCC = 2 V IF = 4 mA RL = 100
Collector current IC (mA)
Forward voltage VF (V)
1.2 1.0
Relative output current IC (%)
IF = 50 mA 10 mA 1 mA
10 4 mA 2 mA 1 1 mA
120 100 80 60 40 20
0.8 0.6 0.4 0.2 0 -40 -20
10-1
0
20
40
60
80
100
10-2 10-1
1
10
102
0 -40 -20
0
20
40
60
80
100
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Ambient temperature Ta (C)
ICEO Ta
103 VCE = 10 V
tr , tf IC
104
100
IC d
VCC = 2 V IF = 4 mA
Relative output current IC (%)
Rise time, fall time tr , tf (s)
102
Dark current ICEO (A)
103
RL = 1 k 500 100
80 d 60
10
102
1
40
10
10-1
VCC = 2 V Ta = 25C : tr : tf 10-1 1 10
20
10-2 -40 -20
0
20
40
60
80 100 120
1 10-2
0 0 2 4 6 8 10
Ambient temperature Ta (C)
Collector current IC (mA)
Distance d (mm)
2
SHG00057AED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR


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